Over the course of 50 years we have grown to become a global company that develops innovative solutions for our customers, and manages the best interests of our investors, our employees, society and other stakeholders. Read on to discover what we achieved in 2018.



Chapter preview

The demand for smaller, faster and cheaper semiconductor chips continues to rise, driven by advancements in cloud computing, artificial intelligence, smartphones and the Internet of Things.


Our technology is the first step towards making it all possible, as our R&D investment in new materials, new products and new processes means we can help our customers develop their technology roadmap, and further extend Moore’s Law.


In 2018, this led to the introduction of the Synergis ALD tool, which leverages the core technologies from our Pulsar and EmerALD ALD products for high productivity thermal ALD applications. The new Synergis tool allows us to address more ALD applications and therefore increases our served market. Together with our other products and services, this contributed to our strong financial results, which included:

  • net sales of €818 million;
  • bookings of €942 million;
  • operating result of €124 million; and
  • operating cash flow of €137 million.


Strategy & business

Chapter preview

We operate in a fast-paced industry that continues to reshape the world, and our innovative technology enables the semiconductor industry to achieve advancements in computing, communications, energy, transportation, medicine and beyond.
To ensure that we can continue to make a difference to our customers, employees, and company stakeholders, in 2018 we concentrated on the following three key elements of our strategy.


In addition to our fundamental R&D efforts, we continuously expand and deepen our strategic cooperation with key customers, suppliers, chemical manufacturers, and research institutes. This approach enables us to remain innovative and swiftly meet the changing demands of our customers.


We are a key player in the deposition equipment segments for ALD and epitaxy, and a focused niche player for PECVD and vertical furnaces. As a leader in the segment, ALD has turned into a key growth driver for our business, from which we support virtually all of the leading customers in the semiconductor industry. Our newest ALD tool, Synergis, is designed to address a wide range of existing and new ALD applications, effectively increasing the market we serve.


In addition to our internal optimization programs, we are working with our suppliers to improve fundamental quality through statistical methods and process controls. In addition to addressing the technology needs of our customers, we also focus on further increasing equipment throughput and equipment reliability, thereby lowering the cost per wafer of our wafer processing systems.


Performance review

Chapter preview

In 2018, we achieved revenue growth of 11% reaching a record high revenue of €818 million, with sales increasing mainly in the logic, DRAM and analog segments. By industry segment, our 2018 revenue stream was led by memory, closely followed by the logic and foundry segments.


While our ALD product lines continued to be our key sales driver in 2018, accounting for more than half of total equipment revenue, our other product lines also contributed strongly. In our epitaxy product line we increased sales, following the strong growth we achieved in 2017, and we saw additional sales increases in PECVD and vertical furnaces.


Our industry experienced continued growth in 2018, with worldwide semiconductor industry sales increasing by around 14%. This was driven by high memory prices and broad-based electronics demand for cloud services, mobile devices, automotive and industrial applications. These drivers helped the wafer fab equipment market grow by around 10% in 2018.



Chapter preview

Our 2018 sales grew to record levels, reaching €818 million. ALD continued to be the key driver, although the other product lines also made a strong contribution.
We benefited from a further increase in wafer fab equipment spending following the very strong market growth in 2017. Our operating profit increased to €124.3 million from €113.2 million in 2017, while the operating profit margin remained stable.


New bookings increased by 22% in 2018 to €942 million, with equipment bookings for ASMI as a whole led by logic, followed by foundry and then memory. Total research and development (R&D) expenses, excluding impairment charges, decreased by 1% in 2018 compared to 2017, mainly as a result of higher capitalization of development expenses.


Financial statements

Chapter preview

Our 2018 sales grew to record levels, reaching €818 million. ALD continued to be the key driver, although the other product lines also made a strong contribution.
We benefited from a further increase in wafer fab equipment spending following the very strong market growth in 2017. Our operating profit increased to €124.3 million from €113.2 million in 2017, while the operating profit margin remained stable.


New bookings increased by 22% in 2018 to €942 million, with equipment bookings for ASMI as a whole led by logic, followed by foundry and then memory. Total research and development (R&D) expenses, excluding impairment charges, decreased by 1% in 2018 compared to 2017, mainly as a result of higher capitalization of development expenses.


Other Information

Chapter preview

During 2018, we returned approximately €607 million to shareholders in the form of dividends, share buybacks and the capital return. This was up from €281 million in 2017 and €140 million in 2016.
Over the 2010-2018 period, we returned more than €1.6 billion to the financial markets through dividends, share buybacks, return of capital, and buyback of convertible bonds.


Sae laccuptatur ad eum fugita alic tem sam aperum fugiatet harum inisin niscit ipid ut danto ipsam doloria sitas qui nobitaspe nos et, saniae receperatium laut ut quiscitae.


In 2018, we paid a dividend of €0.80 per common share and we will propose to the forthcoming AGM to declare a dividend of €1.00 per share for 2019. The proposed 2019 dividend will mark the ninth consecutive year that we have paid a dividend.


Within the semiconductor capital equipment market we operate in the semiconductor wafer processing equipment market segment, primarily for deposition equipment.


In 2018, the semiconductor industry was driven by a US$2.2 trillion global electronics industry (VLSI Research Chip Insider, February 11, 2019) that required approximately US$409 billion of semiconductors, which was up by around 15% compared to 2017, driven mostly by higher prices in memory devices. In turn, the semiconductor industry supported approximately US$80 billion semiconductor capital equipment industry (up around 14% compared to 2017), which supplies the required production systems and services. The equipment segment was driven mostly by capacity expansion in 3D-NAND memory fabs, technology conversion investments in DRAM memory fabs, and new technology generation investments in logic and foundry fabs.


Our products include wafer processing deposition systems for CVD, ALD, epitaxy, and diffusion/furnace. We make two types of process tools: single-wafer and batch. The majority of our business comes from single-wafer tools, which are designed to process an individual wafer in each processing chamber on the tool.

In contrast, a batch tool is designed such that a large number of wafers are processed simultaneously in a larger processing chamber. Batch tools typically achieve a higher throughput compared to single wafer tools.

Single-wafer tools typically achieve a higher level of process performance and control, especially for complex, critical applications. We work closely with our customers to meet their demands, and in recent years we have developed single wafer tools with multiple chambers configured together in a compact way on a single platform. This approach offers the best of both worlds, combining high productivity and a high level of performance.

Our XP platform is a high-productivity, common 300mm single-wafer platform that can be configured with up to four process modules. The XP platform enables high-volume multi-chamber parallel processing or integration of sequential process steps on one platform. The XP common platform benefits our customers through reduced operating costs, as many of our products use the same parts and consumables, and a common control architecture improves ease of use.

Our XP8 platform follows the basic architectural standards of the XP, but provides even higher productivity with up to eight chambers integrated on a single-wafer platform with a small footprint.


We are a leading supplier of ALD equipment and process solutions for the semiconductor industry. Today, our ALD process technology delivers the highest performance available to support the next generation of semiconductor devices. Our epitaxy products have also demonstrated solutions for our customers to achieve transistor channel performance at the most advanced technology nodes.


ALD allows us to deposit thin films atom-by-atom on silicon wafers, meaning we can deliver atomic-scale thickness control, high-quality deposition film properties, and large area uniformity.

With such precision, we can use materials that previously could not be considered, and develop 3D structures that are vital to the future of electronics. 3D technology provides a number of real benefits, including saving space while delivering chips with higher performance that consume less power.


Our ALD technology is being used to build ICs for a wide range of leading-edge products, including high-performance computers and smartphones. The results of ALD are visible everywhere in the world around us.

ALD is also our basic platform for the development of a wide range of new materials. Our research centers across the globe are working on ALD, and we are conducting joint research projects with Europe’s largest independent research institute, imec. Taken together, this helps make ALD one of the principal drivers for future growth in microelectronics.


Using ALD, we can deposit new materials several atoms thick on semiconductor wafers, producing ultra-thin films of exceptional quality and uniformity.

In PEALD, plasma is used to provide the reaction energy for the process, enabling us to use lower temperatures for low-thermal budget applications. This technology was introduced in DRAM and planar NAND flash manufacturing, for spacer-defined double patterning (SDDP), a technique that can reduce device dimensions, postponing the need for new lithography technologies.

Using ALD technology, we can scale devices to smaller dimensions while reducing the power consumption of transistors, all of which helps the industry follow Moore’s Law and create smaller, more powerful semiconductors. For advanced 3D memory applications, where devices are stacked vertically in high densities, ALD is critical for uniformly depositing films in deep trenches and over complicated features. Many new applications are emerging where ALD is the technology of choice, and in a number of cases the only solution that meets the challenging technology requirements.

We expect ALD to be one of the principal drivers of growth in microelectronics over the coming decade. In addition, we expect growth in other deposition technologies, including epitaxy for advanced transistors and PECVD for creating improved interconnects. Looking ahead, we will continue to develop the huge potential of our deposition technologies in support of the semiconductor industry, enabling the industry to support the future demands of consumers and businesses.


Epitaxy is a critical process technology for creating advanced transistors and memories. The epitaxy process is used for depositing precisely controlled crystalline silicon-based layers that are important for semiconductor device electrical properties. In some cases, the epitaxy films incorporate dopant atoms to achieve specific material properties.

Epitaxy process temperature control is of the utmost importance. We have developed new methods of temperature control in our Intrepid ES epitaxy tool that enable improved film performance and repeatability in volume production. Furthermore, Intrepid’s closed-loop reactor temperature control enables enhanced stability in production.


Focusing on product stewardship and product life cycle (PLC) management involves taking responsibility to reduce the product’s environmental impact along its entire life cycle, so from cradle-to-grave. Ultimately, this approach enables us to make products more efficiently and productively for our customers, while extending the products' useful life.

Our product life cycle process follows the well-established construct of phase-gate product development guided by several key inputs:

  • our collective industry knowledge/experience and subject matter experts;
  • industry/customer requirements and frameworks (such as, customer purchase specs and business requirements); and
  • industry regulations, standards, and guidelines.

Product-specific requirements realized from these inputs are documented in market requirement specifications (MRS), which are held as the objectives we need to meet through the product development process. The MRS are updated continually to capture changes to market conditions, regulations and standards, and related specifications.

Governance is provided through key technical meetings (architecture reviews, design reviews and validation reviews) and phase exit meetings through the various life cycle stages of the product.


Product safety is a core element of ASMI’s innovation process, and it is realized through the design, manufacturing, and ongoing support of our products. The requirements are defined and championed by the Product Safety Council which includes engineers representing each of our design centers. These requirements are established in the PLC during the requirements phase, and include legislation and standards from the semiconductor industry and customers. We verify that safety requirements are met during the concept and design phase as part of safety risk assessments, and through independent third-party validations during the product validation phase. In addition, we integrate the identification of opportunities for safety design improvements into our global safety reporting system. This system enables our engineers and technicians who work with our equipment on a daily basis to report incidents, areas of concern, or opportunities for improvement. Corrective actions and lessons learned are captured, providing an invaluable link between the end user and the design process.

Our stakeholders working with our equipment rely on this process of continual assessment, integration, and improvement, to make sure they can safely work with our products.



Over the past 50 years we have grown to become a leading global supplier
of semiconductor wafer processing equipment. A company that develops
innovative process solutions for our customers, and manages itself in the best
interests of our investors, our employees, society, and other stakeholders.

Yet now is the time to enter a new era of innovation, to embark on the next
phase of growth. We understand that this requires commitment and strength
across many areas. From innovation in R&D, to advancing new technologies
and addressing new applications. From developing our people, to creating
even stronger relationships with key customers.

This is how we will take the next leap forward.


Of new materials






Our roadmap to the future will enable us to not only
achieve our next phase of growth, it will ensure we
can continue to help our customers achieve their
technology roadmaps for next-generation devices.


Our technology helps drive innovation, increasing the number of scientific breakthroughs, many of which are achieved from our advanced process equipment that deposits new materials with precision and productivity, positively benefiting society in sectors from healthcare and education, to transport and energy.


For semiconductor manufacturers, scaling chips
to smaller dimensions is an ongoing challenge.
Our innovations and equipment are vital in helping make many of these transitions happen.


Striving for efficiency ensures that our
customers get the products, services,
and results they expect. Intensifying
our focus on efficiency will make us a
stronger company, ready to take the
next leap forward.







We are a multinational company that
embraces diversity in every sense
of the word. With 29 different
nationalities working across the
company, we combine our talents
to drive innovation.


Achieving our ambitions takes intelligence, knowledge, skill,
determination, and dedication. And it is this combination of
qualities that we nurture in our people.


Our goal is to impact tomorrow’s generation
as positively as we’ve impacted today’s.
Making this happen takes the xtraordinary
talent of our people, who work together
to drive innovation and deliver excellence.

Expanding the






Collaboration is fundamental to our
continued success; from working
with our customers to optimize our
equipment and processes to enable
their technology roadmaps, to
creating partnerships on cutting-edge
research and development.


Operational excellence is one of the essential
pillars of our strategy, which enables us to provide
our customers with the high-quality, leading-edge
products and services they demand.


R&D is central to our development,
leading to new device architectures,
new materials, and new processes
that strengthen our competitive
positioning and enable our customers
to deliver the next-generation chips.


By extending our technological scope with a
more diverse product portfolio, we can help our
customers continue to advance their business
while growing our own in new market segments.

Moore with






We create long-term value for our
stakeholders in a variety of ways.
From working with our customers
to develop innovative solutions, to
ensuring value creation growth
and positive investor returns.


We are committed to positively
contributing to society and
reducing our impact on the
environment. Only then can
we truly say we are helping
create more with less.


We believe sustainability takes many forms.
From developing sustainable technology
roadmaps for our customers, to creating
a sustainable living environment for all.


Safety is a front-line requirement,
which is why our ZERO HARM!
policy outlines our vision on product
safety, and our CR policy lays out
our commitment and expectations
towards health and safety.