Our products include wafer processing deposition systems for single-wafer ALD, PECVD, epitaxy and batch diffusion / furnace systems.
ASMI offers ALD tools in two technology segments: thermal ALD and plasma enhanced ALD (PEALD).
Pulsar XP is a 300mm thermal ALD tool designed for depositing extremely thin high-k dielectric materials required for advanced transistor gates and other applications. Pulsar is the benchmark ALD high-k gate dielectric tool for the industry. Up to four Pulsar process modules can be configured on a Pulsar XP system.
EmerALD XP is a 300mm thermal ALD tool designed for depositing metal gate layers for advanced high-k metal gate transistors and other applications. Up to four EmerALD process modules can be configured on an EmerALD XP system.
Eagle XP8 is a high-productivity 300mm tool for PEALD applications. The system can be configured with up to four Dual Chamber Modules (DCM), enabling eight chambers in high-volume production within a very compact footprint. The system is capable of a broad range of dielectric PEALD processes, including low-temperature spacers for multiple patterning applications.
Synergis is a high-productivity 300mm tool for thermal ALD applications. The system can be configured with up to four Dual Chamber Modules (DCM), enabling eight chambers in high-volume production within a very compact footprint. The system is capable of depositing a broad range of thermal ALD films including metal oxides, metal nitrides, dielectrics, and pure metals.
XP8 QCM is a 300mm tool for high-productivity PEALD applications. XP8 QCM allows for the integration of up to 4 modules each containing four process reactors, enabling 16 chambers in high-volume production within a compact footprint.
The Advance is our batch vertical furnace tool, available as the A412 for 300mm wafers and as the A400 for smaller wafer sizes. Various thermal ALD films can be deposited on the batch furnace for high productivity.
We offer two types of CVD tools: single-wafer plasma enhanced CVD (PECVD) and batch low pressure CVD (LPCVD).
Dragon XP8 is a high-productivity 300mm tool for PECVD applications. The system can be configured with up to four Dual Chamber Modules (DCM), enabling eight chambers in high-volume production within a very compact footprint. Processes include a broad range of dielectric PECVD films for applications such as interconnect dielectrics layers, passivation layers, and etch stop layers.
The Advance is our batch vertical furnace tool, available as the A412 for 300mm thermal LPCVD and as the A400 for LPCVD on smaller wafer sizes. CVD applications on the furnace include polysilicon, silicon nitride, and silicon oxide.
We offer two families of epitaxy tools: Intrepid and Epsilon.
Intrepid ES is a 300mm epitaxy tool using our XP platform, and is designed for depositing critical transistor strain and channel layers. Processes include silicon (Si), silicon-germanium (SiGe), silicon-carbon (SiC), and other silicon-based compounds. Up to four Intrepid process modules can be configured on an Intrepid ES system.
The Epsilon series is a single-wafer, single-chamber tool that deposits silicon-based materials for many applications, ranging from high-temperature silicon for wafer manufacturing, to low-temperature silicon, silicon-germanium (SiGe), silicon-carbon (SiC), and other silicon-based compounds. Epsilon is the market leader for epitaxy applications in the analog and power devices market.
We offer batch vertical furnace tools for diffusion and oxidation applications.
The Advance is our batch vertical furnace tool series, available as the A412 for 300mm and as the A400 for smaller wafer sizes. Atmospheric thermal applications on the furnace include diffusion to introduce dopants in materials in controlled amounts, annealing to affect material properties by heating to a specific temperature and oxidation to form silicon oxide.
Service and spare parts are important product offerings for our business. We provide service support to our customers with technical service personnel who are trained to maintain our systems at customers' fabrication plants around the world. Our service team is located globally at regional and local service centers to assure prompt availability.
We sell spare parts for our equipment from parts stocks located at global distribution centers.
Over the past 50 years we have grown to become a leading global supplier
of semiconductor wafer processing equipment. A company that develops
innovative process solutions for our customers, and manages itself in the best
interests of our investors, our employees, society, and other stakeholders.
Yet now is the time to enter a new era of innovation, to embark on the next
phase of growth. We understand that this requires commitment and strength
across many areas. From innovation in R&D, to advancing new technologies
and addressing new applications. From developing our people, to creating
even stronger relationships with key customers.
This is how we will take the next leap forward.
ROADMAP TO THE FUTURE
Our roadmap to the future will enable us to not only
achieve our next phase of growth, it will ensure we
can continue to help our customers achieve their
technology roadmaps for next-generation devices.
Our technology helps drive innovation, increasing the number of scientific breakthroughs, many of which are achieved from our advanced process equipment that deposits new materials with precision and productivity, positively benefiting society in sectors from healthcare and education, to transport and energy.
For semiconductor manufacturers, scaling chips
to smaller dimensions is an ongoing challenge.
Our innovations and equipment are vital in helping make many of these transitions happen.
Striving for efﬁciency ensures that our
customers get the products, services,
and results they expect. Intensifying
our focus on efﬁciency will make us a
stronger company, ready to take the
next leap forward.
We are a multinational company that
embraces diversity in every sense
of the word. With 29 different
nationalities working across the
company, we combine our talents
to drive innovation.
Achieving our ambitions takes intelligence, knowledge, skill,
determination, and dedication. And it is this combination of
qualities that we nurture in our people.
Our goal is to impact tomorrow’s generation
as positively as we’ve impacted today’s.
Making this happen takes the xtraordinary
talent of our people, who work together
to drive innovation and deliver excellence.
Collaboration is fundamental to our
continued success; from working
with our customers to optimize our
equipment and processes to enable
their technology roadmaps, to
creating partnerships on cutting-edge
research and development.
Operational excellence is one of the essential
pillars of our strategy, which enables us to provide
our customers with the high-quality, leading-edge
products and services they demand.
R&D is central to our development,
leading to new device architectures,
new materials, and new processes
that strengthen our competitive
positioning and enable our customers
to deliver the next-generation chips.
By extending our technological scope with a
more diverse product portfolio, we can help our
customers continue to advance their business
while growing our own in new market segments.
We create long-term value for our
stakeholders in a variety of ways.
From working with our customers
to develop innovative solutions, to
ensuring value creation growth
and positive investor returns.
We are committed to positively
contributing to society and
reducing our impact on the
environment. Only then can
we truly say we are helping
create more with less.
We believe sustainability takes many forms.
From developing sustainable technology
roadmaps for our customers, to creating
a sustainable living environment for all.
Safety is a front-line requirement,
which is why our ZERO HARM!
policy outlines our vision on product
safety, and our CR policy lays out
our commitment and expectations
towards health and safety.