By working closely with our customers,
we are intensely focused on developing innovative solutions to the roadmap challenges of realizing advanced technology nodes.
THE THIRD DIMENSION
For certain device types, the technology roadmap includes expanding in the third dimension: in a vertical 3D structure.
For logic devices, the performance scaling requirements have resulted in a 3D gate stack structure, commonly known as FinFETs. We are addressing technology challenges related to these structures through our ALD and epitaxy systems.
Using our equipment and process innovations, our customers can achieve their roadmaps for 3D devices. This enables them to deliver the next-generation chips demanded by the market for high performance electronic systems.