Definitions and abbreviations

AENEAS: AENEAS is an association, established in 2006, providing unparalleled networking opportunities, policy influence & supported access to funding to all types of RD&I participants in the field of micro- and nanoelectronics enabled components and systems.

AGM: Annual General Meeting of Shareholders (AGM) is the annual general meeting of shareholders.

ALD: Atomic Layer Deposition (ALD) is a surface-controlled layer-by-layer process that results in the deposition of thin films one atomic layer at a time. Layers are formed during reaction cycles by alternately pulsing precursors and reactants and purging with inert gas in between each pulse.

BCP: Business Continuity Plan.

CAP: Corrective Action Plan.

CFSI: Conflict-Free Sourcing Initiative (

CMRT: The CFSI Conflict Minerals Reporting Template (CMRT) is an industry widely adopted standard template used by companies to collect conflict minerals due diligence data.

Conflict Minerals/3TG: Tin, tantalum, tungsten and gold.

CONNECT!: ASMI’s internal newsletter.

COSO: The Committee of Sponsoring Organizations of the Treadway Commission (COSO) is a joint initiative of five private sector organizations listed that is dedicated to providing thought leadership through the development of frameworks and guidance on enterprise risk management, internal control and fraud deterrence.

CR: Corporate Responsibility.

CVD: Chemical Vapor Deposition (CVD) is a chemical process used to produce high quality, high-performance, solid materials. The process is often used in the semiconductor industry to produce thin films. In typical CVD, the wafer (substrate) is exposed to one or more volatile precursors, which react and/or decompose on the substrate surface to produce the desired deposit. Frequently, volatile by-products are also produced, which are removed by gas flow through the reaction chamber.

DCM: Dual Chamber Module.

DFX: Term used interchangeably, where the X is a variable which can have one of many possible values, such as design for manufacturability, power, variability, cost, yield, reliability, or sustainability (DFS).

DRAM: Dynamic Random Access Memory.

DRC: The Democratic Republic of Congo.

ECO: Engineering change order.

EHS: Environmental, Health & Safety.

EICC: The Electronic Industry Citizenship Coalition (EICC) is the former name of the Responsible Business Alliance (RBA). The RBA rebranded from EICC in 2017.

Epitaxy (EPI): Epitaxy is one of a portfolio of wafer processing technologies for which we provide equipment. The word comes from the Greek epi meaning above, and taxis meaning in an ordered manner. It involves the deposition of silicon or silicon compounds to form layers that help to continue and perfect the crystal structure of the bare silicon wafer below. Epitaxy improves the electrical characteristics of the wafer surface, making it suitable for highly complex microprocessors and memory devices. Selective Epitaxy is an Epitaxy process that only deposits silicon or a silicon compound on certain predetermined areas of the wafer.

FinFET: A Field Effect Transistor (FET) architecture that uses a raised channel, referred to as a fin, from source to drain. A finFET is a considered a 3D transistor since the channel is in a vertical orientation.

FLBL: Forced Labor/Bonded Labor.

FMEA: Failure Mode Effects Analysis.

GES: ASMI’s Global Employment Standards.

GRI: The Global Reporting Initiative (GRI) is an international independent standards organization that helps businesses, governments and other organizations understand and communicate their impacts on issues such as climate change, human rights and corruption (

IC: Integrated Circuit.

IFRS: International Financial Reporting Standards.

ILO: International Labor Organization.

imec: imec is an internationally renowned research institute that performs research in different fields of nanoelectronics. It is headquartered in Leuven, Belgium, and has offices in the Netherlands, Taiwan, US, China, India, Nepal and Japan.

IoT: Internet of Things.

IP: Intellectual Property.

ISO 14001: The ISO 14001 Environment Management System (EMS) standard is an internationally recognized environmental management standard.

NCG: New College Graduate (NCG).

NGOs: Non-Government Organizations.

LPCVD and Oxidation/Diffusion: Low Pressure Chemical Vapor Deposition (LPCVD) is a thermal process that deposits various films at low pressure. LPCVD processes include polysilicon, silicon nitride and silicon oxides. Diffusion (sometimes referred to as annealing) is a thermal treatment used to move dopants, or impurities, and make dopants introduced by ion implantation electrically active. Oxidation forms a silicon oxide layer on the wafer’s surface, which acts as an insulating or protective layer over it.

NAND: A type of nonvolatile memory device technology which does not require power to retain its data. NAND flash memory is used in mobile phones, USB memory drives, solid state drives and other electronic products.

OECD: OECD (Organization for Economic Cooperation and Development) is an international organization helping governments tackle the economic, social and governance challenges of a globalized economy. It publishes guidance and frameworks such as OECD Due Diligence Guidance for Responsible Supply Chains of Minerals from Conflict-Affected and High-Risk Areas.

PEALD: Plasma Enhanced ALD (PEALD) uses specific chemical precursors just like in thermal ALD. However, it also makes use of cycling an RF-plasma to create the necessary chemical reactions in a highly controlled manner.

PECVD: Plasma Enhanced Chemical Vapor Deposition (PECVD) is the CVD that utilizes plasma to enhance chemical reaction rates of the precursors. PECVD processing allows deposition at lower temperatures, which is often critical in the manufacture of semiconductors. The lower temperatures also allow for the deposition of organic coatings, such as plasma polymers, that have been used for nanoparticle surface functionalization.

PLC: Product Life Cycle.

R&D: Research and Development.

RBA: Responsible Business Alliance – Industry coalition seeking to create a industry-wide standards on social, environmental and ethical issues in the industry supply chain. Rebranded from the Electronics Industry Citizenship Coalition (EICC) in October 2017.

RCOI: Reasonable Country of Origin Inquiries (RCOI).

SAQ: Self-Assessment Questionnaire (SAQ) is one of the EICC’s standardized risk assessment tools.

SDG: United Nations Sustainable Development Goals.

SEAJ: Semiconductor Equipment Association Japan.

SEMI: Semiconductor Equipment and Materials International (SEMI) is a global industry association of companies that provide equipment, materials and services for the manufacture of semiconductors, photovoltaic panels, LED and flat panel displays, micro-electromechanical systems (MEMS), and related micro and nanotechnologies.