MARKETS & PRODUCTS
The semiconductor capital equipment market is composed of three major market segments: wafer processing equipment, assembly and packaging equipment, and test equipment. We operate in the semiconductor wafer processing equipment market, primarily for deposition equipment.
In 2016 the semiconductor industry was driven by a US$1.94 trillion global electronics industry (VLSI Research Chip Insider, February 14, 2017) that required approximately US$290 billion of semiconductors. In turn, the semiconductor industry supported the approximately US$54.4 billion semiconductor capital equipment industry, which supplies the required production systems and services.
We serve the wafer processing equipment segment, which is part of the capital equipment segment. This is worth approximately US$35.2 billion annually. Demand for semiconductor capital equipment is driven both by growth in the market for semiconductor devices and the new technology needed to realize the next generation of devices.
In 2016 the semiconductor industry increased by about 2.1%, driving the equipment business up 11.4%. The equipment segment was driven mostly by capacity expansion in 3D NAND memory fabs and new technology generation investments in logic and foundry fabs.
LOGIC, FOUNDRY AND MEMORY MARKETS
- Our semiconductor wafer processing business supplies equipment to the leading semiconductor manufacturers in the logic, foundry, and memory markets, primarily for the deposition of thin films.
- The logic market is made up of manufacturers who create chips that are used to process data. Known as the central processing unit (CPU), this microprocessor is the ‘brains’ of a computer system, and can be found in smartphones, laptops, and computers.
- The foundry market consists of businesses that operate semiconductor fabrication plants to manufacture the designs of other so-called fabless semiconductor companies.
- The memory market covers manufacturers who make chips that store information either temporarily, such as Random Access Memory (RAM), or permanently, such as NAND non-volatile memory. The NAND memory market has evolved to include 3D NAND chips, which are designed for the vertical stacking of memory cells to increase bit density.
ANALOG DEVICE MARKETS
We also supply equipment to leading manufacturers of analog semiconductor devices, which are important for enabling the increasing semiconductor content used in most products worldwide.
The analog market includes a wide array of chip types, including:
- power management;
- signal processing;
- discretes; and others.
The industry recently adopted the phrase called 'More than Moore', to identify and acknowledge a strongly-growing market of various types of analog chips which are not driven by the same Moore’s Law technology scaling inflections of mainstream logic and memory chips.
The semiconductor capital equipment market is composed of three major market segments:
- wafer processing equipment;
- assembly and packaging equipment;
- test equipment.
We are active in the wafer processing segment. Within wafer processing equipment, the major segments are:
- ion implant;
- etch & clean; and
- process diagnostics.
The principal market segment in which we participate is deposition and related tools. According to VLSI, the deposition segment was worth approximately US$8.8 billion in 2016.
Within the deposition market, the major equipment technology segments are:
- chemical vapor deposition (CVD);
- physical vapor deposition (PVD);
- atomic layer deposition (ALD);
- rapid thermal processing (RTP);
- epitaxy; and
Our products include wafer processing deposition systems for CVD, ALD, epitaxy, and diffusion/furnace. We make two types of process tools: single wafer and batch. The majority of our business comes from single wafer tools, which are designed to process an individual wafer in each processing chamber on the tool. In contrast, a batch tool is designed such that a large number of wafers are processed simultaneously in a larger processing chamber. Batch tools typically achieve a higher throughput compared to single wafer tools. Single wafer tools typically achieve a higher level of process performance and control, especially for complex, critical applications. We work closely with our customers to meet their demands, and in recent years we have developed single wafer tools with multiple chambers configured together in a compact way on a single platform. This approach offers the best of both worlds, combining high productivity and a high level of performance.
Our XP platform is a high-productivity common 300mm single wafer platform that can be configured with up to four process modules. The XP platform enables high-volume multi-chamber parallel processing or integration of sequential process steps on one platform. The XP common platform benefits our customers through reduced operating costs, as many of our products use the same parts and consumables, and a common control architecture improves ease of use.
Our XP8 platform follows the basic architectural standards of the XP, but provides even higher productivity with up to eight chambers integrated on a single wafer platform with a small footprint.
PRODUCT APPLICATIONS AND DESCRIPTIONS
atomic layer deposition (ALD)
ASMI offers ALD tools in two technology segments: Thermal ALD and plasma enhanced ALD (PEALD).
Pulsar XP ALD system
Pulsar XP is a 300mm thermal ALD tool designed for depositing extremely thin high-k dielectric materials required for advanced transistor gates and other applications. Pulsar is the benchmark ALD high-k gate dielectric tool for the industry. Up to four Pulsar process modules can be configured on a Pulsar XP system.
EmerALD XP ALD system
EmerALD XP is a 300mm thermal ALD tool designed for depositing metal gate layers for advanced high-k metal gate transistors and other applications. Up to four EmerALD process modules can be configured on an EmerALD XP system.
Eagle XP8 PEALD system
Eagle XP8 is a high-productivity 300mm tool for PEALD applications. The system can be configured with up to four Dual Chamber Modules (DCM), enabling eight chambers in high-volume production within a very compact footprint. The system is capable of a broad range of dielectric PEALD processes, including low-temperature spacers for multiple patterning applications.
Advance series batch vertical furnace
The Advance is our batch vertical furnace tool, available as the A412 for 300mm wafers and as the A400 for smaller wafer sizes. Various thermal ALD films can be deposited on the batch furnace for high productivity.
Chemical Vapor Deposition (CVD)
ASMI offers two types of CVD tools: Single wafer plasma enhanced CVD (PECVD) and batch low pressure CVD (LPCVD).
Dragon XP8 PECVD system
Dragon XP8 is a high-productivity 300mm tool for PECVD applications. The system can be configured with up to four Dual Chamber Modules (DCM), enabling eight chambers in high-volume production within a very compact footprint. Processes include a broad range of dielectric PECVD films for applications such as interconnect dielectrics layers, passivation layers, and etch stop layers.
Advance series batch vertical furnace
The Advance is our batch vertical furnace tool, available as the A412 for 300mm thermal LPCVD and as the A400 for LPCVD on smaller wafer sizes. CVD applications on the furnace include polysilicon, silicon nitride and silicon oxide.
We offer two families of Epitaxy tools: Intrepid and Epsilon.
Intrepid XP epitaxy system
Intrepid XP is a 300mm epitaxy tool designed for critical transistor strain and channel layers. Processes include silicon (Si), silicon-germanium (SiGe), silicon-carbon (SiC), and other silicon-based compounds. Up to four Intrepid process modules can be configured on an Intrepid XP system.
The Epsilon series is a single wafer, single chamber tool that deposits silicon-based materials for many applications, ranging from high-temperature silicon for wafer manufacturing, to low-temperature silicon, silicon-germanium (SiGe), silicon-carbon (SiC), and other silicon-based compounds. Epsilon is the market leader for epitaxy applications in the analog and power devices market.
We offer batch vertical furnace tools for diffusion and oxidation applications.
Advance series batch vertical furnace
The Advance is our batch vertical furnace tool series, available as the A412 for 300mm and as the A400 for smaller wafer sizes. Atmospheric thermal applications on the furnace include diffusion to introduce dopants in materials in controlled amounts, annealing to affect material properties by heating to a specific temperature and oxidation to form silicon oxide.
Service and spare parts
Service and spare parts are important product offerings for ASMI’s business. ASMI provides service support to our customers with technical service personnel who are trained to maintain our systems at customers' fabrication plants around the world. Our service team is located globally at regional and local service centers to assure prompt availability.
We sell spare parts for our equipment from parts stocks located at global distribution centers.